New standard allows stacked dies in 3-D integrated circuits to connect with test equipment

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This week, IMEC, a world-leading research and innovation hub in nanoelectronics and digital technologies, announced that IEEE Std 1838TM-2019—recently approved by the IEEE Standards Association—will be included in IEEE Xplore Digital Library from February 2020 onward. The new standard allows die makers to design dies which, if compliant to this standard, constitute, once stacked in a 3-D-IC by a stack integrator, a consistent stack-level test access architecture. The standardization effort of the 3-D-DfT (design-for-test) was initiated by IMEC.

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