Engineers demonstrate the first flexible hardware platform for silicon spin qubit integration on 300 mm wafers

At the IEEE International Electron Devices Meeting (IEDM2020), R&D hub IMEC demonstrated the first flexible hardware platform for silicon spin qubit integration on 300 mm wafers. Physicists from IMEC also proposed novel ways to operate multiple qubits in a linear array and to combine classical electronics with quantum circuits at low temperatures. These are significant steps forward in the development of large-scale silicon quantum processors, highlighted as a key emerging technology on IEDM.